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We can
build for you a customized gas System and integrate the generic parts you need.
IGC II
SEMI-PR3.1 compilant design
Compact footprint minimizes space requirements
Lightweight, easy-to-assemble components
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Technical Data
Service Ratings
Pressure rating: 3000 psig (206 bar) at 70 F (21C),
for substrate and manifold components.
Temperate rating: 120 C (248 F) operating: 150C .302
F) bakeout.
Wetted components: 316L VIM.VAR stainless steel.
Non-wetted components: aluminum (hard-coat anodized
alloy 2024-T351), stainless steel (alloy A286 and 303 SS), and
plastic (polyethersulfone)
Wetted components: electropolished 5 uin. (O.13um) Ra
avg
Cleaning and Processing
Wetted Swagelok Ultrahigh-Purity Specification SC-01
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The IGC II
System
A typical IGC II system consists of three layers - a
substrate assembly, a manifold assembly, and mounting components.
The manifold and substrate assemblies are combined to form
the conduit for the system gas, and can be customized for any flow configuration.
The IGC II components are assembled with simple
mounting components and standard hardware.
The IGC II system accepts any SEMI-PR3.1 compliant surface mount
component.
The Swagelok IGC II System Configurator. MS-21-22. is available on CD
ROM to simplify the layout, selection, and ordering of IGC II components. |
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Substrate Assembly
The assembly provides the flow path for the process gas through the gas stick.
The substrate assembly consists of a substrate channel and a variety of drop-in
flow components.
The substrate channels are available in a variety of lengths to accommodate up to 14 surface-mounts. |

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Manifold
Assembly
The
manifold assembly provides the flow path between two, or more parallel gas sticks.
The manifold assembly consists of a manifold channel and a variety of drop-in
flew components.
The manifold channels are available in a variety of lengths to accommodate up
to 10 parallel gas sticks.
Optional parallel manifold assemblies are available to provide an additional flow
path parallel gas sticks. |

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Substrate - Manifold Assembly
The substrate assembly bolts over manifold the assembly.
Ac-ring gasket assembly (not visible) provides a leaklight seal between
the substrate component and manifold below.
The substrate-manifold assembly accept any SEMI-PR3.1 compliant
surface mount component. |

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Mounting Components and Caps
A foot block to each end of the gas stick, providing panel-mount
capability.
A support
block provides mid-line supports for longer
gas sticks.
A conversion plate provides the mounting capacity for a mass flow
controller.
A cap is available to cover an unused positbn on a substrate or manifold.
A tube port is available to provide a 1/4 inch vertical tube port on a manifold
or substrate. |

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IGS
system
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Features:
Improve
Basic Technology: safety and Clean Technology;
Miniaturization: use
of UPG & W-Seal Technology; reduce
Size of Actuator ( 35mm to 25mm);
Increase
Reliability: use of UPG & W-Seal Technology;
Simple
to Make & Maintain: all Top Mount Components;
uniform Connections; easier to Heat;
Promote
Standardization: full Line-up of Standard Components;
standardize Design & Assembly with Flexibility;
reduce Leadtime with Standard Parts;
Cost
Reduction: reduced Overall Cost Through Standardization,
increased Reliability, and Ease of Assembly.
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Sample
IGS configurations
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IGS
PANEL WITH FCS. FCS (Flow control system) is
a high perfomance prefilter, regulator, pressure
transducer, and MFC in one compact package that
reduces the size of assemblies by one third.
Available in analog and digital versions.
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IGS
PANEL FOR GAS SUPPLY SYSTEMS. VMB (Valve Manifold
Box) allows for more efficient use of cleanroom
space.
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ULTRA-COMPACT
IGS (1,125"). Next generation ultra-compact
IGS based upon the 1,125" footprint. Gas
panels are smaller and lighter without sacrificing
flow capacity.
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